Feature Check

The main features of the module are the following:

  • Conforms to the HCC Advanced Embedded Framework.
  • Designed for integration with both RTOS and non-RTOS based systems.
  • Supports Micron® MT29FxG01 SPI NAND flash and is easily configurable for similar NAND flash parts.
  • Supports static and dynamic wear leveling.
  • Provides bad block management.